NTP4302, NTB4302

http://onsemi.com

6

PACKAGE DIMENSIONS

CASE 418AA−01

ISSUE O

STYLE 2:

PIN 1. GATE

2. DRAIN

3. SOURCE

4. DRAIN

SEATING

PLANE

S

G

D

−T−

M

0.13 (0.005)

T

23

1

4

3 PL

K

J

V

E

C

A

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.340

0.380

8.64

9.65

B

0.380

0.405

9.65

10.29

C

0.160

0.190

4.06

4.83

D

0.020

0.036

0.51

0.92

E

0.045

0.055

1.14

1.40

G

0.100 BSC

2.54 BSC

J

0.018

0.025

0.46

0.64

K

0.090

0.110

2.29

2.79

S

0.575

0.625

14.60

15.88

V

0.045

0.055

1.14

1.40

−B−

M

B

W

W

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

F

0.310

−−−

7.87

−−−

M

0.280

−−−

7.11

−−−

M

F

M

F

M

F

VARIABLE

CONFIGURATION

ZONE

U

VIEW W−W

VIEW W−W

VIEW W−W

12

3

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8.38

0.33

1.016

0.04

17.02

0.67

10.66

0.42

3.05

0.12

5.08

0.20

mm

inches

SCALE 3:1