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MSM125 Datasheet(PDF) 3 Page - StarHope |
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MSM125 Datasheet(HTML) 3 Page - StarHope |
3 / 3 page Termination pad characteristics Terminal pad materials Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Thermal Derating Curve Typical Time-To-Trip At 25°C Recommended Solder Reflow Conditions Soldering ‧Recommended reflow methods:IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom side of the board. ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). ‧Devices can be cleaned using standard method and solvents. Note:If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. mSMD mSMD SeriesPreheating Cooling Derating Curves for mSMD Series 0 20 40 60 80 100 120 140 160 -40 -20 0 20 40 60 80 Temperature (°C) 60-120 sec. 120 sec. 30-60 sec. 300 200 160 0 250 190 100 Average Time Current Curves 0.001 0.01 0.1 1 10 100 0.1 1 10 100 Current In Amperes 0.10A 0.14A 0.20A 0.30A 0.50A 0.75A 1.10A 1.25A 1.50A 2.00A 2.50A 2.60A Package Information Reel: MSM010~350 1500pcs/reel PPTC/MSM Series 03 | www.spsemi.cn REV.2014.05.01 |
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