PCM2903C

SBFS038 – JUNE 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

TRANSPORT

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

MEDIA,

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

PCM2903CDB

Rails, 47

PCM2903CDB

SSOP-28

DB

–25°C to 85°C

PCM2903C

Tape and Reel,

PCM2903CDBR

2000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

PARAMETER

PCM2903C

UNIT

–0.3 to 4

V

±0.1

V

Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU

±0.1

V

SEL0, SEL1, DIN

–0.3 to 6.5

V

Digital input voltage

D+, D–, HID0, HID1, HID2, XTI, XTO, DOUT, SSPND

V

V

Input current (any pins except supplies)

±10

mA

Ambient temperature under bias

–40 to +125

°C

–55 to +150

°C

+150

°C

Lead temperature (soldering, 5 s)

+260

°C

Package temperature (IR reflow, peak)

+250

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

PCM2903C

DB (SSOP)

UNITS

28 PINS

Junction-to-ambient thermal resistance

64.5

Junction-to-case (top) thermal resistance

24.5

Junction-to-board thermal resistance

25.4

°C/W

Junction-to-top characterization parameter

2.0

Junction-to-board characterization parameter

25.0

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Product Folder Link(s): PCM2903C