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LM5060 Datasheet(PDF) 3 Page - Texas Instruments |
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LM5060 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 33 page LM5060 www.ti.com SNVS628E – OCTOBER 2009 – REVISED JANUARY 2012 Pin Descriptions (continued) Pin Name Description Applications Information No. The UVLO pin is used as an input Under-Voltage Lock-Out by connecting this pin to a resistor divider between input supply voltage and ground. The UVLO comparator is activated when EN is Under-Voltage Lock- 4 UVLO high. A voltage greater than typically 1.6V at the UVLO pin will release the pull down devices on Out Comparator Input the GATE pin and allow the output to gradually rise. A constant current sink (5.5 µA typical) is provided to guarantee the UVLO pin is low in an open circuit condition. A voltage less than 0.8V on the EN pin switches the LM5060 to a low current shutdown state. A voltage greater than 2.0V on the EN pin enables the internal bias circuitry and the UVLO 5 EN Enable Input comparator. The GATE pin pull-up bias is enabled when both EN and UVLO are in the high state. A constant current sink (6 µA typical) is provided to guarantee the EN pin is low in an open circuit condition. 6 GND Circuit ground An external capacitor connected to this pin sets the VDS fault detection delay time. If the TIMER 7 TIMER Timing capacitor pin exceeds the 2.0V threshold condition, the LM5060 will latch off the MOSFET and remain off until either the EN, UVLO or VIN (POR) input is toggled low and then high. An open drain output. When the external MOSFET VDS decreases such that the OUT pin voltage 8 nPGD Fault Status exceeds the SENSE pin voltage, the nPGD indicator is active (low = no fault). Connect to the output rail (external MOSFET source). Internally used to detect VDS and VGS 9 OUT Output VoltageSense conditions. Connect to the external MOSFET’s gate. A charge-pump driven constant current source (24 µA typical) charges the GATE pin. An internal zener clamps the GATE pin at typically 16.8V above 10 GATE Gate drive output the OUT pin. The ΔV/Δt of the output voltage can be reduced by connecting a capacitor from the GATE pin to ground. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) VIN to GND (2) (3) -0.3V to 75V SENSE, OUT to GND (4) -0.3V to 75V GATE to GND (2) (4) -0.3V to 75V EN, UVLO to GND (3) -0.3V to 75V nPGD, OVP to GND -0.3V to 75V TIMER to GND -0.3V to 7V ESD Rating, HBM (5) 2 kV Storage Temperature −65°C to + 150°C Peak Reflow Temperature(6) 260°C Junction Temperature 150°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including in-operability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Operating Range conditions indicate the conditions at which the device is functional and the device should not be operated beyond such conditions. For guaranteed specifications and conditions, see the Electrical Characteristics table. (2) The GATE pin voltage is typically 12V above the VIN pin when the LM5060 is enabled. Therefore, the Absolute Maximum Rating for VIN (75V) applies only when the LM5060 is disabled, or for a momentary surge to that voltage since the Absolute Maximum Rating for the GATE pin is also 75V. (3) The minimum voltage of -1V is allowed if the current is limited to below -25 mA. Also it is assumed that the negative voltage on the pins only occur during reverse battery condition when a positive supply voltage (Vin) is not applied. (4) The minimum voltage of -25V is allowed if the current is limited to below -25 mA. Also it is assumed that the negative voltage on the pins only occur during reverse battery condition when a positive supply voltage (VIN) is not applied. (5) The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. Applicable standard is JESD- 22–A114–C. (6) Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Reflow temperature profiles are different for lead-free and non-lead-free packages. Refer to the Packaging Data Book available from National Semiconductor, or : www.national.com/analog/packaging Copyright © 2009–2012, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM5060 |
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