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LM5060 Datasheet(PDF) 3 Page - Texas Instruments

Part # LM5060
Description  High-Side Protection Controller with Low Quiescent Current
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM5060 Datasheet(HTML) 3 Page - Texas Instruments

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LM5060
www.ti.com
SNVS628E – OCTOBER 2009 – REVISED JANUARY 2012
Pin Descriptions (continued)
Pin
Name
Description
Applications Information
No.
The UVLO pin is used as an input Under-Voltage Lock-Out by connecting this pin to a resistor
divider between input supply voltage and ground. The UVLO comparator is activated when EN is
Under-Voltage Lock-
4
UVLO
high. A voltage greater than typically 1.6V at the UVLO pin will release the pull down devices on
Out Comparator Input
the GATE pin and allow the output to gradually rise. A constant current sink (5.5 µA typical) is
provided to guarantee the UVLO pin is low in an open circuit condition.
A voltage less than 0.8V on the EN pin switches the LM5060 to a low current shutdown state. A
voltage greater than 2.0V on the EN pin enables the internal bias circuitry and the UVLO
5
EN
Enable Input
comparator. The GATE pin pull-up bias is enabled when both EN and UVLO are in the high
state. A constant current sink (6 µA typical) is provided to guarantee the EN pin is low in an open
circuit condition.
6
GND
Circuit ground
An external capacitor connected to this pin sets the VDS fault detection delay time. If the TIMER
7
TIMER
Timing capacitor
pin exceeds the 2.0V threshold condition, the LM5060 will latch off the MOSFET and remain off
until either the EN, UVLO or VIN (POR) input is toggled low and then high.
An open drain output. When the external MOSFET VDS decreases such that the OUT pin voltage
8
nPGD
Fault Status
exceeds the SENSE pin voltage, the nPGD indicator is active (low = no fault).
Connect to the output rail (external MOSFET source). Internally used to detect VDS and VGS
9
OUT
Output VoltageSense
conditions.
Connect to the external MOSFET’s gate. A charge-pump driven constant current source (24 µA
typical) charges the GATE pin. An internal zener clamps the GATE pin at typically 16.8V above
10
GATE
Gate drive output
the OUT pin. The
ΔV/Δt of the output voltage can be reduced by connecting a capacitor from the
GATE pin to ground.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
VIN to GND
(2) (3)
-0.3V to 75V
SENSE, OUT to GND (4)
-0.3V to 75V
GATE to GND (2) (4)
-0.3V to 75V
EN, UVLO to GND (3)
-0.3V to 75V
nPGD, OVP to GND
-0.3V to 75V
TIMER to GND
-0.3V to 7V
ESD Rating, HBM (5)
2 kV
Storage Temperature
−65°C to + 150°C
Peak Reflow Temperature(6)
260°C
Junction Temperature
150°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including in-operability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Operating Range conditions indicate
the conditions at which the device is functional and the device should not be operated beyond such conditions. For guaranteed
specifications and conditions, see the Electrical Characteristics table.
(2)
The GATE pin voltage is typically 12V above the VIN pin when the LM5060 is enabled. Therefore, the Absolute Maximum Rating for VIN
(75V) applies only when the LM5060 is disabled, or for a momentary surge to that voltage since the Absolute Maximum Rating for the
GATE pin is also 75V.
(3)
The minimum voltage of -1V is allowed if the current is limited to below -25 mA. Also it is assumed that the negative voltage on the pins
only occur during reverse battery condition when a positive supply voltage (Vin) is not applied.
(4)
The minimum voltage of -25V is allowed if the current is limited to below -25 mA. Also it is assumed that the negative voltage on the
pins only occur during reverse battery condition when a positive supply voltage (VIN) is not applied.
(5)
The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. Applicable standard is JESD-
22–A114–C.
(6)
Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Reflow temperature profiles
are different for lead-free and non-lead-free packages. Refer to the Packaging Data Book available from National Semiconductor, or :
www.national.com/analog/packaging
Copyright © 2009–2012, Texas Instruments Incorporated
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