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NC12MC0561 Datasheet(PDF) 5 Page - AVX Corporation |
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NC12MC0561 Datasheet(HTML) 5 Page - AVX Corporation |
5 / 5 page STORAGE Good solderability is maintained for at least twelve months, provided the components are stored in their “as received” packaging at less than 40°C and 70% RH. SOLDERABILITY / LEACHING Terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds. Terminations will resist leaching for at least the immersion times and conditions recommendations shown below. NB products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. This includes Pb free reflow processes with peak temperatures up to 270ºC. Recommended profiles for reflow and wave soldering are shown below for reference. NC products are recommended for lead soldering application or gluing techniques. Surface Mounting Guide Chip Thermistor – Application Notes REFLOW SOLDERING WAVE SOLDERING 18 P/N Termination Solder Solder Immersion Type Tin/Lead Temp ºC Time Seconds NC AgPdPt 60/40 260 ± 5 15 max NB Nickel Barrier 60/40 260 ± 5 30 ± 1 Case P/N D1 D2 D3 D4 D5 Size 0402 NB23 1.70 0.60 0.50 0.60 0.50 (.067) (.024) (.020) (.024) (.020) 0603 NB21 2.30 0.80 0.70 0.80 0.75 (.091) (.031) (.028) (0.31) (.030) 0805 NB12 3.00 1.00 1.00 1.00 1.25 (.118) (.039) (.039) (.039) (.049) 1206 NB20 4.00 1.00 2.00 1.00 2.50 (.157) (.039) (.079) (.039) (.098) Case P/N D1 D2 D3 D4 D5 Size 0603 NB21 3.10 1.20 0.70 1.20 0.75 (.122) (.047) (.028) (.047) (.030) 0805 NB12 4.00 1.50 1.00 1.50 1.25 (.157) (.059) (.039) (.059) (.049) 1206 NB20 5.00 1.50 2.00 1.50 1.60 (.197) (.059) (.079) (.059) (.063) Reflow 300 250 200 150 100 50 0 10 sec. max 1min 1min (Minimize soldering time) Natural Cooling 220ºC to 250ºC Preheat a) The visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) Resin color may darken slightly due to the increase in temperature required for the new pastes. c) Lead-free solder pastes do not allow the same self align- ment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. 300 250 200 150 100 50 0 0 50 100 150 200 250 300 • Pre-heating: 150°C ±15°C / 60-90s • Max. Peak Gradient: 2.5°C/s • Peak Temperature: 245°C ±5°C • Time at >230°C: 40s Max. Time (s) Wave 300 250 200 150 100 50 0 3 sec. max 1 to 2 min (Preheat chips before soldering) T/maximum 150°C Preheat Natural Cooling 230ºC to 250ºC T D1 D2 D3 D4 D5 RECOMMENDED SOLDERING PAD LAYOUT Dimensions in mm (inches) |
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