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NC12MC0561 Datasheet(PDF) 5 Page - AVX Corporation

Part # NC12MC0561
Description  NTC SMD Thermistors
Download  5 Pages
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Manufacturer  AVX [AVX Corporation]
Direct Link  http://www.avx.com
Logo AVX - AVX Corporation

NC12MC0561 Datasheet(HTML) 5 Page - AVX Corporation

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STORAGE
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes
with
peak
temperatures
up
to
270ºC.
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
Surface Mounting Guide
Chip Thermistor – Application Notes
REFLOW SOLDERING
WAVE SOLDERING
18
P/N
Termination
Solder
Solder
Immersion
Type
Tin/Lead
Temp ºC
Time Seconds
NC
AgPdPt
60/40
260 ± 5
15 max
NB
Nickel Barrier
60/40
260 ± 5
30 ± 1
Case
P/N
D1
D2
D3
D4
D5
Size
0402
NB23
1.70
0.60
0.50
0.60
0.50
(.067)
(.024)
(.020)
(.024)
(.020)
0603
NB21
2.30
0.80
0.70
0.80
0.75
(.091)
(.031)
(.028)
(0.31)
(.030)
0805
NB12
3.00
1.00
1.00
1.00
1.25
(.118)
(.039)
(.039)
(.039)
(.049)
1206
NB20
4.00
1.00
2.00
1.00
2.50
(.157)
(.039)
(.079)
(.039)
(.098)
Case
P/N
D1
D2
D3
D4
D5
Size
0603
NB21
3.10
1.20
0.70
1.20
0.75
(.122)
(.047)
(.028)
(.047)
(.030)
0805
NB12
4.00
1.50
1.00
1.50
1.25
(.157)
(.059)
(.039)
(.059)
(.049)
1206
NB20
5.00
1.50
2.00
1.50
1.60
(.197)
(.059)
(.079)
(.059)
(.063)
Reflow
300
250
200
150
100
50
0
10 sec. max
1min
1min
(Minimize soldering time)
Natural
Cooling
220ºC
to
250ºC
Preheat
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
300
250
200
150
100
50
0
0
50
100
150
200
250
300
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient: 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
Time (s)
Wave
300
250
200
150
100
50
0
3 sec. max
1 to 2 min
(Preheat chips before soldering)
T/maximum 150°C
Preheat
Natural
Cooling
230ºC
to
250ºC
T
D1
D2
D3
D4
D5
RECOMMENDED
SOLDERING PAD
LAYOUT
Dimensions in
mm (inches)


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