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REF3320 Datasheet(PDF) 2 Page - Texas Instruments |
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REF3320 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 24 page TLV3691 SBOS694 – DECEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) MIN MAX UNIT Supply voltage +7 V Voltage(2) (V–) – 0.5 (V+) + 0.5 V Signal input terminals Current(2) ±10 mA Output short-circuit(3) continuous mA Operating, TA –55 +150 °C Temperature Storage, Tstg –65 +150 °C Junction, TJ +150 °C Human body model (HBM) 2.5 kV Electrostatic discharge (ESD) ratings Charged-device model (CDM) 1 kV (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should be current-limited to 10 mA or less. (3) Short-circuit to ground, one comparator per package. THERMAL INFORMATION TLV3691 THERMAL METRIC(1) DCK (SC70) DPF (DFN) UNITS 5 PINS 6 PINS θJA Junction-to-ambient thermal resistance 297.4 252.4 θJCtop Junction-to-case (top) thermal resistance 109.3 93.9 θJB Junction-to-board thermal resistance 74.4 192.8 °C/W ψJT Junction-to-top characterization parameter 3.0 3.0 ψJB Junction-to-board characterization parameter 73.6 203.8 θJCbot Junction-to-case (bottom) thermal resistance N/A N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TLV3691 |
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