1

2

3

4

8

7

6

5

V

CC

2OUT

2IN

-

2IN+

1OUT

1IN

-

1IN+

GND

V

CC

IN

-

OUT

GND

IN+

1

2

3

5

4

TLV3201

TLV3202

www.ti.com

SBOS561A – MARCH 2012 – REVISED JUNE 2012

THERMAL INFORMATION

TLV3201

TLV3202

DBV

DCK

D

DGK

UNITS

(SOT23)

(SC70)

(SOIC)

(MSOP)

5 PINS

5 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

237.8

281.9

146.3

201.9

Junction-to-case (top) thermal resistance

108.7

97.6

97.2

92.5

Junction-to-board thermal resistance

64.1

68.3

84.2

123.3

°C/W

Junction-to-top characterization parameter

12.1

2.6

45.5

23.0

Junction-to-board characterization parameter

63.3

67.3

83.7

121.6

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

PIN CONFIGURATIONS

D AND DGK PACKAGES

DCK AND DBV PACKAGES

SOIC-8 AND MSOP-8

SC70-5 AND SOT23-5

(TOP VIEW)

(TOP VIEW)

PIN DESCRIPTIONS: D, DGK

NAME

NO.

DESCRIPTION

1IN–

2

Negative input, comparator 1

1IN+

3

Positive input, comparator 1

1OUT

1

Output, comparator 1

2IN–

6

Negative input, comparator 2

2IN+

5

Positive input, comparator 2

2OUT

7

Output, comparator 2

GND

4

Negative supply, ground

8

Positive supply

PIN DESCRIPTIONS: DCK, DBV

NAME

NO.

DESCRIPTION

OUT

1

Output

GND

2

Negative supply, ground

IN+

3

Positive input

5

Positive supply

IN–

4

Negative input

Copyright © 2012, Texas Instruments Incorporated

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