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LMH6619-Q1 Datasheet(PDF) 2 Page - Texas Instruments |
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LMH6619-Q1 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 30 page ADC121S625 0.1 PF 10 PF V + 33: V + 560: 220 pF 560: - + 0.1 PF 10 PF V + V + 560: 560: 33: 560: 220 pF 560: INPUT 10 PF - + LMH6619 LMH6619 LMH6619Q SNOSC78A – JUNE 2012 – REVISED NOVEMBER 2012 www.ti.com Typical Application Figure 1. Single to Differential ADC Driver These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) ESD Tolerance (2) Human Body Model For input pins only 2000V For all other pins 2000V Machine Model 200V Supply Voltage (VS = V + – V−) 12V Junction Temperature (3) 150°C max Storage Temperature Range –65°C to 150°C Soldering Information: See product folder at www.ti.com and www.ti.com/ lit/an/snoa549c /snoa549c.pdf. (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. (2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (3) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. Operating Ratings (1) Supply Voltage (VS = V + – V−) 2.7V to 11V Ambient Temperature Range (2) −40°C to +105°C Package Thermal Resistance ( θJA) 8-Pin SOIC 160°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: LMH6619Q |
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