ADC122S021

www.ti.com

SNAS280D – MARCH 2005 – REVISED MARCH 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

−0.3V to 6.5V

Voltage on Any Pin to GND

±10 mA

±20 mA

Human Body Model

2500V

Machine Model

250V

Junction Temperature

+150°C

Storage Temperature

−65°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For specifications and test conditions, see the Electrical

Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the

device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND = 0V, unless otherwise specified.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an

limited by the Analog Supply Voltage specification.

(5)

a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is

reversed). Obviously, such conditions should always be avoided.

(6)

Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 220 pF discharged through zero ohms.

OPERATING RATINGS

(1) (2)

Operating Temperature Range

+2.7V to +5.25V

Digital Input Pins Voltage Range

Clock Frequency

50 kHz to 16 MHz

Analog Input Voltage

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For specifications and test conditions, see the Electrical

Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the

device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND = 0V, unless otherwise specified.

PACKAGE THERMAL RESISTANCE

Package

8-lead VSSSOP

250°C / W

Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(1)

(1)

Reflow temperature profiles are different for lead-free and non-lead-free packages.

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