© 1996 Fairchild Semiconductor Corporation

www.fairchildsemi.com

NC7SZ14 • Rev. 1.0.3

8

2. DIMENSIONS ARE IN MILLIMETERS

1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD

MAC06AREVC

Notes:

3. DRAWING CONFORMS TO ASME Y14.5M-1994

TOP VIEW

RECOMMENED

LAND PATTERN

BOTTOM VIEW

1.45

1.00

A

B

0.05 C

0.05 C

2X

2X

0.55MAX

0.05 C

(0.49)

(1)

(0.75)

(0.52)

(0.30)

6X

1X

6X

PIN 1

DETAIL A

0.075 X 45

CHAMFER

0.25

0.15

0.35

0.25

0.40

0.30

0.5

(0.05)

1.0

5X

DETAIL A

PIN 1 TERMINAL

0.40

0.30

0.45

0.35

0.10

0.00

0.10

CB A

0.05

C

C

0.05 C

0.05

0.00

5X

5X

6X

(0.13)

4X

6X

Figure 9. 6-Lead, MicroPak™, 1.0mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify

or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically

the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

Tape and Reel Specification

Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:

Package Designator

Tape Section

Cavity Number

Cavity Status

Cover Type Status

L6X

Leader (Start End)

125 (Typical)

Empty

Sealed

Carrier

5000

Filled

Sealed

Trailer (Hub End)

75 (Typical)

Empty

Sealed