2

H-XES

Series

Series

http://www.microdc.cn

Technical Enquiries-Email:tech@microdc.cn Tel:0086-20-86000646

Page 3 of 3

General

Specifications

Parameters

Conditions

Typical

Maximum

Units

Switching frequency

100% load

50

KHz

Operating temperature

Full Load without Derating

-40 to +85

℃

Storage temperature

-40 to +125

℃

Max Case temperature

90

℃

Cooling

Free air convection

%

Humidity

90

%

Case material

Plastic UL94-VO

Weight

3.8

g

Dimensions (L x W x H)

1.25 x 0.34 x 0.53 inches

31.80 x 8.60 x 13.47 mm

MTBF

>1 500 000 hrs (MIL-HDBK -217F, Ground Benign, t=+25 C)

NOTE: All specifications in this datasheet are measured at an ambient temperature of 25°C, humidity<75%, nominal input voltageand at rated output load

unless otherwise specified

Pin

1000VDC

3000 and 6000VDC

1

+V Input

+V Input

2

N.C.

-V Input

3

N.C.

N.C.

9

N.C.

N.C.

10

-V Output

-V Output

11

+V Output

+V Output

12

-V Input

N.C.

Pin

Specifications

Microdc Professional Power Module,Inc.

Tel:0086-20-86000646 E-mail:tech@microdc.cn

Website:http://www.microdc.cn

RoHS COMPLIANT INFORMATION

This series is compatible with RoHS soldering systems with a peak wave solder temperature

of 300°C for 10 seconds.

The pin termination finish on the SIP package type is Tin Plate, Hot Dipped over Matte Tin

with Nickel Preplate. The DIP types are Matte Tin over Nickel Preplate. Both types in this

series are backward compatible with Sn/Pb soldering systems.

REACH COMPLIANT INFORMATION

This series has proven that this product does not contain harmful chemicals, it also has

harmful chemical substances through the registration, inspection and approval.