PLB010050 Series

| Advanced Datasheet

Datasheet No 292420 Issue 3

Page 4 of 5

17/04/2014

Forward Voltage Bin Groups

Group

Min.

Max.

V1

2.8

2.9

V2

2.9

3.0

V3

3.0

3.1

V4

3.1

3.2

V5

3.2

3.3

Mechanical Specifications

Description

Dimensions

Tolerance

Chip Area (µm)

510 x 510

+5/-35

Chip Thickness (µm)

150

± 10

Diameter of top (Al) Bond Pad (µm)

100 x 100

± 10

Al Bond Pad Thickness (µm)

2

± 0.2

Back Contact Metal (Au) Area (µm)

510 x 510

+5/-35

Back Contact Metal Thickness (µm)

1.1

±0.05

Handling Instructions

Plessey LEDs are not designed to operate with reverse bias.

Precautions are required to prevent reverse bias in applications and during handling.