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Data Sheet

SML-21 series

lAttention Points In Handling

This product was developed as a surface mount LED especially suitable for reflow soldering.

Please take care of following points when using this device.

1.DESIGNING OF PCB

As for a recommendable solder pattern, Please refer to Fig-1.

The size and direction of the pad pattern depends on the condition of the PCB,

So, please investigate about the adjustmentthoroughly before designing.

2.SOLDERING (Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu)

LED products do not contain reinforcement

materials such as glass fillers.

Therefore, thermal stress by soldering greatly

influences its reliability.

The temperature conditions for reflow soldering

should therefore be set up according to the

characteristic of this product. (See Fig-2)

Number of reflow process shall be max 2 times

and these processes shall be performed in a row.

Cooling process to normal temperature shall be required

between the first and the second soldering process.

3.HANDLING AFTER MOUNTING

As shown right drawing, in case outside force of around1kg is given

to the device, stress is concentrated to the jointed part

between mold resin and substrate.

Therefore there is a possibility to breat the device or PCB.

Careful handing is needed as ROHM cannot guarantee the falling of the device by outside force after mounting.

4.WASHING

Please note the following points when washing is required after soldering.

4-1) WASHING SOLVENT

Isopropyl alcohol or other alcohol solvent is recommendable.

4-2) TEMPERATURE

Below 30ºC, immersion time ; within 3 minutes.

4-3) ULTRA SONIC WASHING

Below 15/1 litter of solvent tub.

4-4) COOLING

Below 100ºC within 3 minutes.

5.EROSION GAS

Utilization in erosion gas atmosphere may degenerate the plating surface which might cause deterioration of

solder strength, optical characteristics, or functions.

Please take precautions against occurrence of gas from the surrounding parts on the occasion of custody,

and also after mounted on circuit board.

Min.1 min

Max. 40sec

Max.260ºC, Within 10sec

140 to 180ºC

230 to 260ºC

(Fig-2)

(Fig-1)

1.1m

1.1m

1.25

1.25

PCB Bonding Direction

Outside

PCB

Mold

Substrat

Soldering

part

Emitting

7/8

2013.08 - Rev.C