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QFBR-TT09Z Datasheet(PDF) 4 Page - AVAGO TECHNOLOGIES LIMITED |
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QFBR-TT09Z Datasheet(HTML) 4 Page - AVAGO TECHNOLOGIES LIMITED |
4 / 4 page Qualification Plan: Result Assessment Result Assessment Result Assessment Result Assessment MSL‐3 Moisture Level Definition (MLD) MSL – 3 24hrs bake @125°C, 192 +5/‐0 hrs soak at 30°C /60%RH, 1x wavesolder 260°C/+ 5°C, 10s 0/11 Pass 0/11 Pass 0/11 Pass MSL‐4 Moisture Level Definition (MLD) MSL – 4 24hrs bake @125°C, 96 +5/‐0 hrs soak at 30°C /60%RH, 1x wavesolder 260°C/+ 5°C, 10s 0/11 Pass TMCL Temperature Cycling (TMCL) MIL‐STD‐883 Method 1010 Ta = ‐40°C to +100°C 200cyc, 500cyc, and 1000cyc @ 25°C 0/33 Pass 0/33 Pass 0/33 Pass 0/33 Pass uB85/85 TX: Unbiased Damp Heat (UB85/85) 0/22 Pass 0/22 Pass B85/85 RX: Biased Damp Heat (B85/85) 0/22 Pass 0/22 Pass HTOL High Temperature Operating Life (HTOL) Section 5.18 (GR‐ 468‐CORE) Ta = 85°C, Vcc=5,25V 168hrs, 500hrs and 1000hrs @ 25°C 0/22 Pass 0/22 Pass 0/22 Pass 0/22 Pass Mechanical Shock (MS) 1 MIL‐STD‐883 Method 2002B 1500g (peak), 0.5ms, 5 pulses/surface, 6 surfaces 0/11 Pass 0/11 Pass 0/11 Pass 0/11 Pass Mechanical Vibration (MV) 1 MIL‐STD‐883 Method 2007A 20 – 2000HZ, 20 G 4min/cycle, 4cycle/axis, 3 axis 0/11 Pass 0/11 Pass 0/11 Pass 0/11 Pass HFBR‐1521Z HFBR‐1527Z HFBR‐2521Z HFBR‐2526Z SAM: check Delamination @ 0hrs and after solder Test Points MS/MV MIL‐STD‐202 Method 103 Ta= 85°C, RH=85% Vcc=5,25V, 168hrs, 500hrs and 1000hrs @ 25°C Post MS/MV Test Reference Condition JEDEC 020D.1 ___________________________________________________________________________________________ These changes have been reviewed and approved by Avago Technologies engineers and managers per Avago Technologies procedure: Change Control and Customer Notification, A-5962-6052-80. Please contact your Avago Technologies field sales engineer or Contact Center (http://www.avagotech.com/contact/ ) for any questions or support requirements. Please return any response as soon as possible, but not to exceed 30 days. |
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