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00-10-11 Datasheet(PDF) 3 Page - List of Unclassifed Manufacturers

Part No. 00-10-11
Description  Add case outline M. Technical changes and corrections to table I. Editorial changes throughout.
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STANDARD
MICROCIRCUIT DRAWING
SIZE
A
77034
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
3
DSCC FORM 2234
APR 97
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device except for those devices that use a RHA
designator
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
M
See figure 1
3
Power surface mount
N
See figure 1
3
Surface mount
T 1/
See figure 1
3
TO-257 flange mount, glass sealed
U 1/
See figure 1
3
TO-257 flange mount with isolated tab, glass sealed
X
See figure 1
3
TO-39 can
Y
MBFM1-P2
2
Flange mount
Z
MBFM4-P2
2
Flange mount
2
CQCC1-N20
20
Square leadless chip carrier
4
See figure 1
3
SMD-257-A flange mount, glass sealed
5
See figure 1
18
Rectangular leadless chip carrier
6
See figure 1
18
Rectangular leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 2/
Power dissipation (PD):
Case X ....................................................................................................... 2 W
Cases M, N, T, U, Y, Z and 4 (internally limited) ....................................... 20 W
Case 2:
At TA = +25°C ......................................................................................... 1.1 W
At TC = +25°C ........................................................................................ 6.2 W
Cases 5 and 6 at TC = +25°C ..................................................................... 10 W
Input-output voltage differential:
Device types 01, 03, 05, 06 ....................................................................... 40 V dc
Device types 02, 07 ................................................................................... 60 V dc
Device types 04, 08 ................................................................................... 50 V dc
Operating junction temperature range ........................................................... -55
°C to +150°C
Storage temperature ..................................................................................... -65
°C to +150°C
Lead temperature (soldering, 10 seconds) ................................................... 300
°C
Thermal resistance, junction to case (
θ
JC):
Cases M, N, and T ................................................................................... 3.5
°C/W
Cases U and 4 ........................................................................................ 4.2
°C/W
Case X .................................................................................................... 15
°C/W
Case Y .................................................................................................... 3
°C/W
Case Z .................................................................................................... 5
°C/W
Case 2 ..................................................................................................... See MIL-STD-1835
Cases 5 and 6 ......................................................................................... 13
°C/W
1/
For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ceramic seal.
2/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.




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