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MF-USMF150 Datasheet(PDF) 2 Page - Bourns Electronic Solutions |
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MF-USMF150 Datasheet(HTML) 2 Page - Bourns Electronic Solutions |
2 / 4 page Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USMF Series - PTC Resettable Fuses Product Dimensions DIMENSIONS: MM (INCHES) Model AB C D Min. Max. Min. Max. Min. Max. Min. MF-USMF005 3.00 (0.118) 3.43 (0.135) 2.35 (0.093) 2.80 (0.110) 0.80 (0.031) 1.1 (0.043) 0.30 (0.012) MF-USMF010 3.00 (0.118) 3.43 (0.135) 2.35 (0.093) 2.80 (0.110) 0.80 (0.031) 1.1 (0.043) 0.30 (0.012) MF-USMF020 3.00 (0.118) 3.43 (0.135) 2.35 (0.093) 2.80 (0.110) 0.80 (0.031) 1.1 (0.043) 0.30 (0.012) MF-USMF035 3.00 (0.118) 3.43 (0.135) 2.35 (0.093) 2.80 (0.110) 0.55 (0.022) 0.85 (0.033) 0.30 (0.012) MF-USMF050 3.00 (0.118) 3.43 (0.135) 2.35 (0.093) 2.80 (0.110) 0.55 (0.022) 0.85 (0.033) 0.30 (0.012) MF-USMF075 3.00 (0.118) 3.43 (0.135) 2.35 (0.093) 2.80 (0.110) 0.55 (0.022) 0.85 (0.033) 0.30 (0.012) MF-USMF110 3.00 (0.118) 3.43 (0.135) 2.35 (0.093) 2.80 (0.110) 0.55 (0.022) 0.85 (0.033) 0.30 (0.012) MF-USMF150 3.00 (0.118) 3.43 (0.135) 2.35 (0.093) 2.80 (0.110) 0.40 (0.016) 0.85 (0.033) 0.30 (0.012) MF-USMF175X 3.00 (0.118) 3.43 (0.135) 2.35 (0.093) 2.80 (0.110) 0.40 (0.016) 0.85 (0.033) 0.30 (0.012) Packaging: 3000 pcs. per reel. Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. A B C Top and Bottom View Side View D 160–220 300 250 200 150 100 50 0 10–20 120 Preheating Soldering Cooling Time (seconds) Solder Reflow Recommendations Notes: • MF-USMF models cannot be wave soldered. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC Soldering Recommendation guidelines. Recommended Pad Layout 2.5 ± 0.1 (.098 ± .004) 2.0 ± 0.1 (.079 ± .004) 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) |
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