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HFM105 Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers

Part # HFM105
Description  Plastic package has Underwriters Laboratory
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HFM105 Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers

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WEJ
ELECTRONIC
CO.,LTD
Ultra fast recovery type
Features
Plastic package has Underwriters Laboratory
FlammabilityClassification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
Mechanical data
Case : Molded plastic, JEDEC DO-214AC
Terminals : Solder plated, s olderable per MIL-STD-750,
Method 2026
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : 0.0015 ounce, 0.05 gr am
(V)
(V)
(V)
(V)
(nS)
(oC)
HFM101
H11
50
35
50
HFM102
H12
100
70
100
HFM103
H13
200
140
200
HFM104
H14
300
210
300
HFM105
H15
400
280
400
HFM106
H16
600
420
600
HFM107
H17
800
560
800
-55 to +150
Operating
temperature
V
RRM
*1
V
RMS
*2
V
R
*3
V
F
*4
T
RR
*5
50
1.0
1.3
75
SYMBOLS
MARKING
CODE
1.7
MAXIMUM RATINGS (AT TA=25
oC unless otherwise noted)
PARAMETER
CONDITIONS
Symbol
MIN.
TYP.
MAX.
UNIT
Forward rectified current
Ambient temperature = 50
oC
IO
1.0
A
Forward surge current
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
IFSM
30
A
VR = VRRM TA =
25
oC
5.0
uA
VR = VRRM TA = 100
oC
150
uA
Thermal resistance
Junction to ambient
R
qJA
32
oC / w
Diode junction capacitance
f=1MHz and applied 4vDC reverse voltage
CJ
20
pF
Storage temperature
TSTG
-55
+150
oC
Reverse current
IR
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
*5 Reverse recovery time
Http:// www.wej.cn
E-mail:wej@yongerjia.com
WEJ ELECTRONIC CO.
H11-H17
0.205(5.2)
0.189(4.8)
0.012(0.3)Typ
0.110(2.8)
0.094(2.4)
0.181(4.6)
0.165(4.2)
0.075(1.9)
0.067(1.7)
0.040(1.0)Typ
0.040(1.0)Typ
S M A -L
PATENT PUBLICATION NO 37116
.
RoHS


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