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3.0SMCJ64A Datasheet(PDF) 1 Page - Diotec Semiconductor |
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3.0SMCJ64A Datasheet(HTML) 1 Page - Diotec Semiconductor |
1 / 3 page 3.0SMCJ5.0A ... 3.0SMCJ170CA 3.0SMCJ5.0A ... 3.0SMCJ170CA Surface mount unidirectional and bidirectional Transient Voltage Suppressor Diodes Unidirektionale und bidirektionale Spannungs-Begrenzer-Dioden für die Oberflächenmontage Version 2014-09-15 Dimensions - Maße [mm] Peak pulse power dissipation Impuls-Verlustleistung 3000 W Nominal Stand-off voltage Nominale Sperrspannung 5.0...170 V Plastic case Kunststoffgehäuse ~ SMC ~ DO-214AB Weight approx. – Gewicht ca. 0.21 g Plastic material has UL classification 94V-0 Gehäusematerial UL94V-0 klassifiziert Standard packaging taped and reeled Standard Lieferform gegurtet auf Rollen For bidirectional types (add suffix “CA”), electrical characteristics apply in both directions. Für bidirektionale Dioden (ergänze Suffix “CA”) gelten die elektrischen Werte in beiden Richtungen. Maximum ratings and Characteristics Grenz- und Kennwerte Peak pulse power dissipation (10/1000 µs waveform) Impuls-Verlustleistung (Strom-Impuls 10/1000 µs) TA = 25°C PPPM 3000 W 1) Steady state power dissipation Verlustleistung im Dauerbetrieb TT = 75°C P M(AV) 6 W Peak forward surge current, 60 Hz half sine-wave Stoßstrom für eine 60 Hz Sinus-Halbwelle TA = 25°C I FSM 300 A 2) Max. instantaneous forward voltage Augenblickswert der Durchlass-Spannung I F = 100 A VF < 3.0 V 2) Operating junction temperature – Sperrschichttemperatur Storage temperature – Lagerungstemperatur Tj TS -50...+150°C -50...+150°C Thermal resistance junction to ambient air Wärmewiderstand Sperrschicht – umgebende Luft RthA < 33 K/W 3) Thermal resistance junction to terminal Wärmewiderstand Sperrschicht – Anschluss RthT < 10 K/W 1 Non-repetitive pulse see curve I PP = f (t) / PPP = f (t) Höchstzulässiger Spitzenwert eines einmaligen Impulses, siehe Kurve I PP = f (t) / PPP = f (t) 2 Unidirectional diodes only – Nur für unidirektionale Dioden 3 Mounted on P.C. board with 50 mm2 copper pads at each terminal Montage auf Leiterplatte mit 50 mm2 Kupferbelag (Lötpad) an jedem Anschluss © Diotec Semiconductor AG http://www.diotec.com/ 1 0.15 Type Typ 1.2 7.9±0.2 7.2 ±0.5 |
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