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HTG12B0 Datasheet(PDF) 3 Page - Holtek Semiconductor Inc |
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HTG12B0 Datasheet(HTML) 3 Page - Holtek Semiconductor Inc |
3 / 33 page Pad Assignment Chip size: 3060 ´ 5140 (mm)2 * The IC substrate should be connected to VSS in the PCB layout artwork. HTG12B0 3 September 8, 1999 1 48 2 49 3 50 4 51 5 52 6 53 7 54 8 55 9 56 10 57 11 58 12 59 13 60 14 61 15 62 16 63 17 64 18 65 19 66 20 67 21 68 22 69 23 70 24 71 25 72 26 73 27 74 28 75 29 76 30 77 31 78 32 79 80 81 82 83 37 84 38 85 39 86 40 87 41 88 42 89 43 90 44 91 45 92 46 93 47 94 (0 , 0 ) 36 35 34 33 PM 2 PM 1 PM 0 PS 3 PS 2 PS 1 PS 0 TM C L K RE S PB 3 PB 2 PB 1 PB 0 PA 0 PA 1 PA 2 PA 3 T1 D BZ BZ VDD OS C O OS C I XO U T XI N VS S CO M 0 SE G 3 9 SE G 3 8 SE G 3 7 SE G 3 6 SE G 3 5 SE G 3 4 SE G 3 3 SE G 3 2 SE G 3 1 SE G 3 0 SE G 2 9 SE G 2 8 SE G 2 7 SE G 2 6 SE G 2 5 SE G 2 4 SE G 2 3 SE G 2 2 SE G 2 1 SE G 2 0 SE G 1 9 |
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