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AN-6099 Datasheet(PDF) 3 Page - Fairchild Semiconductor |
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AN-6099 Datasheet(HTML) 3 Page - Fairchild Semiconductor |
3 / 11 page AN-6099 APPLICATION NOTE © 2013 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.0.1 • 3/12/13 3 channel width-to-length ratio. The other concept originally developed for high-voltage devices, but now being used for low-voltage devices as well; is the use of charge balance or super-junction device structures. With the use of the charge balance approach, two-dimensional charge coupling in the drift region can be obtained. The latest middle-voltage power MOSFETs from Fairchild employ this shielded-gate structure, where the shield electrode is connected to the source, as shown in Figure 4. The shield electrode, along with the thicker oxide between electrode and drift region, provides charge balance for drift region. This enables higher doping in the drift region, resulting in reduced drift resistance. The specific resistance of these new medium- voltage power MOSFETs has been significantly improved over the previous generation, while improving on the already superior switching characteristic. Apart from RDS(ON) and QG, body diode reverse recovery, internal gate resistance, and the output charge of the MOSFET (QOSS) are now becoming more relevant in synchronous rectification. The importance of these loss components rises at higher switching frequencies and higher output currents. Fairchild’s new medium-voltage MOSFETs are being optimized to minimize the diode reverse recovery as well as the output capacitance. The latest PowerTrench ® MOSFET, FDP045N10A, employs shielded-gate structure that provides charge balance. By utilizing this advanced technology, the FOM (QG×RDS(ON))) is 66% and 38% lower than the previous generation and competitor MOSFETs, as shown in Figure 5. Figure 5. Normalized Figure of Merit (FOM) [RDS(ON)*QG] Power Losses in Synchronous Rectification Conduction Loss Power losses in secondary rectification are very critical, especially in low-voltage and high-current applications, as shown in Figure 6. Therefore, secondary-side synchronous rectification is an excellent solution to improve system efficiency. As shown in Figure 7, the conduction loss of diode rectifier contributes significantly to the overall power loss in a power supply. The rectifier conduction loss is proportion to the product of its forward-voltage drop, VF, and the forward current, IF. Synchronous rectification presents a resistive V-I characteristic. The forward-voltage drop of synchronous rectification can be lower than that of a diode rectifier and, consequently, dramatically reduces the rectifier conduction loss. Conduction loss can be obtained through below equation: PCon =I 2 RMS • RDS(ON) (1) For high-voltage MOSFETs, the resistance of packages has not been a concern. RDS(ON) can be achieved at 1~2 m in a TO-220 standard package, depending on the voltage rating, by using modern medium voltage MOSFETs technology. Unlike high-voltage MOSFETs, the package itself contributes a significant portion of the total resistance for medium-voltage MOSFETs due to wire bonding, lead, and source metal. For example, up to around 33% of the RDS(ON) is accounted for by the package resistance in a 75 V/2.3 MOSFET, as shown in Figure 8. SO-8 packages were popular before upgraded power package Power56. Total on resistance of medium-voltage MOSFET can be dramatically reduced by using an SMD package, such as Power56. It can also reduce package inductance that causes undesirable voltage spikes. It enables use of lower RDS(ON) MOSFETs by replacing lower voltage rating MOSFETs. Figure 6. Power Losses Analysis in ATX Power Supply Figure 7. Power Losses Comparison between Diode Rectification and Synchronous Rectification |
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