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AN-6099 Datasheet(PDF) 3 Page - Fairchild Semiconductor

Part # AN-6099
Description  New PowerTrench MOSFET with Shielded Gate Technology Increases System Efficiency and Power Density in Synchronous Rectification Applications
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

AN-6099 Datasheet(HTML) 3 Page - Fairchild Semiconductor

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AN-6099
APPLICATION NOTE
© 2013 Fairchild Semiconductor Corporation
www.fairchildsemi.com
Rev. 1.0.1 • 3/12/13
3
channel width-to-length ratio. The other concept originally
developed for high-voltage devices, but now being used for
low-voltage devices as well; is the use of charge balance or
super-junction device structures. With the use of the charge
balance approach, two-dimensional charge coupling in the
drift region can be obtained. The latest middle-voltage
power MOSFETs from Fairchild employ this shielded-gate
structure, where the shield electrode is connected to the
source, as shown in Figure 4. The shield electrode, along
with the thicker oxide between electrode and drift region,
provides charge balance for drift region. This enables higher
doping in the drift region, resulting in reduced drift
resistance. The specific resistance of these new medium-
voltage power MOSFETs has been significantly improved
over the previous generation, while improving on the
already superior switching characteristic. Apart from RDS(ON)
and QG, body diode reverse recovery, internal gate
resistance, and the output charge of the MOSFET (QOSS) are
now becoming more relevant in synchronous rectification.
The importance of these loss components rises at higher
switching
frequencies
and
higher
output
currents.
Fairchild’s new medium-voltage MOSFETs are being
optimized to minimize the diode reverse recovery as well as
the output capacitance. The latest PowerTrench
® MOSFET,
FDP045N10A,
employs
shielded-gate
structure
that
provides charge balance. By utilizing this advanced
technology, the FOM (QG×RDS(ON))) is 66% and 38% lower
than the previous generation and competitor MOSFETs, as
shown in Figure 5.
Figure 5. Normalized Figure of Merit (FOM) [RDS(ON)*QG]
Power Losses in Synchronous
Rectification
Conduction Loss
Power losses in secondary rectification are very critical,
especially in low-voltage and high-current applications, as
shown in Figure 6. Therefore, secondary-side synchronous
rectification is an excellent solution to improve system
efficiency. As shown in Figure 7, the conduction loss of
diode rectifier contributes significantly to the overall power
loss in a power supply. The rectifier conduction loss is
proportion to the product of its forward-voltage drop, VF,
and the forward current, IF. Synchronous rectification
presents a resistive V-I characteristic. The forward-voltage
drop of synchronous rectification can be lower than that of a
diode rectifier and, consequently, dramatically reduces the
rectifier conduction loss. Conduction loss can be obtained
through below equation:
PCon =I
2
RMS • RDS(ON)
(1)
For high-voltage MOSFETs, the resistance of packages has
not been a concern. RDS(ON) can be achieved at 1~2 m in a
TO-220 standard package, depending on the voltage rating,
by using modern medium voltage MOSFETs technology.
Unlike
high-voltage
MOSFETs,
the
package
itself
contributes a significant portion of the total resistance for
medium-voltage MOSFETs due to wire bonding, lead, and
source metal. For example, up to around 33% of the RDS(ON)
is accounted for by the package resistance in a 75 V/2.3 
MOSFET, as shown in Figure 8. SO-8 packages were
popular before upgraded power package Power56. Total on
resistance of medium-voltage MOSFET can be dramatically
reduced by using an SMD package, such as Power56. It can
also reduce package inductance that causes undesirable
voltage spikes. It enables use of lower RDS(ON) MOSFETs by
replacing lower voltage rating MOSFETs.
Figure 6. Power Losses Analysis in ATX Power Supply
Figure 7. Power Losses Comparison between Diode
Rectification and Synchronous Rectification


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