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HSMG-C670 Datasheet(PDF) 6 Page - Agilent(Hewlett-Packard) |
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HSMG-C670 Datasheet(HTML) 6 Page - Agilent(Hewlett-Packard) |
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6 / 7 page  1-217 Figure 6. Recommended SMT Reflow Soldering Profile. Figure 7. Recommended Solder Patterns. 2.0 (0.08) 21.0 (0.83) Ø13.0 (0.51) 1.5 (0.06) TYP. 13.0 (0.51) 10.0 (0.39) 60 ° 60 ° 178.0 (7.01) Ø 80.0 (3.15) Ø LABEL Figure 8. Reeling Orientation. CATHODE SIDE PRINTED LABEL USER FEED DIRECTION Figure 9. Reel Dimensions. 1.1 (0.043) 1.75 (0.069) 2.0 (0.079) 1.75 (0.069) 1.0 (0.039) 1.0 (0.039) 0.4 (0.016) HSMF-C655 SERIES 1.1 (0.043) HSMX-C670 SERIES 1.75 (0.069) 2.0 (0.079) 1.75 (0.069) 1.50 (0.059) HSMX-C650 SERIES 1.25 (0.049) 1.25 (0.049) 230 °C MAX. 10 SEC. MAX. 4 °C/SEC. MAX. OVER 2 MIN. TIME 4 °C/SEC. MAX. 140-160 °C . -3 °C/SEC. MAX. NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES). |
Similar Part No. - HSMG-C670 |
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Similar Description - HSMG-C670 |
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