Integrated Circuit

Heat Sinks

11

Pin Fin Heat Sink/Clip Assembly for BGAs and PowerPC™ Packages

Standard

Base Dimensions

Dimensions “A”

Typical

Heat Sink

Weight

P/N

in. (mm)

in. (mm)

Applications

Finish

lbs. (grams)

609-50AB

2.895 (73.5) x 2.000 (50.8)

0.500 (12.7)

40&45mm BGA

Black Anodized

0.094 (42.5)

609-100AB

2.808 (71.32) x 1.700 (43.2)

1.00 (25.4)

40&45mm BGA

Black Anodized

0.130 (59.0)

Note: Optional factory preapplied thermal interface material.

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

609-50AB HEAT SINK

AND CLIP ASSEMBLY

(609-50AB)

AIR VELOCITY (LFM)

609-50AB

609-100AB

1

0

100

200

300

400

500

2

3

4

5

FORCED CONVECTION THERMAL PERFORMANCE DATA

(FLOW PARALLEL TO EXTRUSION DIRECTION)

Fan Heat Sink for BGA and PowerPC™ Packages

Standard

Base Dimensions

Height

Typical

Heat Sink

Thermal

Weight

P/N

in. (mm)

in. (mm)

Applications

Finish

Performance

lbs. (grams)

61995AB124D1

2.871 (72.92) x 1.98 (50.29)

0.953 (24.21)

40&45mm BGA

Black Anodized

1.2° C/W

.150 (68.10)

61995AB054D1

2.871 (72.92) x 1.98 (50.29)

0.953 (24.21)

40&45mm BGA

Black Anodized

1.2° C/W

.150 (68.10)

Note: Optional factory preapplied thermal interface material. See 609 series.

MECHANICAL DIMENSIONS

FEATURES AND BENEFITS:

•

Captivated clips for ease of assembly

•

Low acoustic noise

•

Impingement air flow

•

Accommodates BGA packages up to 45 mm in size

“A”

DIM.

2.808

(609-100AB)

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs

*

*Performance is for shrouded conditions. 609-100

will perform better than 609-50 in cases with bypass.

Designed to fit a .063” thick PCB

electronic package thickness of .110”

Dimensions: in.

See 609 Series for PCB hole layout for clip attachment

609 SERIES

619 SERIES