Die Datasheet

GAP3SHT33-CAL

Mar 2014

http://www.genesicsemi.com/index.php/hit-sic/baredie

Pg1 of 1

SPICE Model Parameters

This is a secure document. Please copy this code from the SPICE model PDF file on our website

(http://www.genesicsemi.com/images/hit_sic/baredie/schottky/GAP3SHT33-CAL_SPICE.pdf)

into

LTSPICE (version 4) software for simulation of the GAP3SHT33-CAL.

*

MODEL OF GeneSiC Semiconductor Inc.

*

*

$Revision:

1.1

$

*

$Date:

03-MAR-2014

$

*

*

GeneSiC Semiconductor Inc.

*

43670 Trade Center Place Ste. 155

*

Dulles, VA 20166

*

*

COPYRIGHT (C) 2013 GeneSiC Semiconductor Inc.

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ALL RIGHTS RESERVED

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* These models are provided "AS IS, WHERE IS, AND WITH NO WARRANTY

* OF ANY KIND EITHER EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED

* TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A

* PARTICULAR PURPOSE."

* Models accurate up to 2 times rated drain current.

*

* Start of GAP3SHT33-CAL SPICE Model

*

.SUBCKT GAP3SHT33 ANODE KATHODE

R1 ANODE INT R=((TEMP-24)*0.0535)

D1 INT KATHODE GAP3SHT33_25C

D2 ANODE KATHODE GAP3SHT33_PIN

.MODEL GAP3SHT33_25C D

+ IS

1.39E-14

RS

2.88

+ N

1.0120127

IKF

36.05007504

+ EG

1.2

XTI

-3

+ CJO

6.01E-11

VJ

0.924257443

+ M

0.3084545

FC

0.5

+ TT

1.00E-10

BV

3700

+ IBV

1.00E-03

VPK

3300

+ IAVE

3.00E-01

TYPE

SiC_Schottky

+ MFG

GeneSiC_Semiconductor

.MODEL GAP3SHT33_PIN D

+ IS

178.99E-18

RS

15

+ N

5

EG

3.23

+ XTI

50

FC

0.5

+ TT

0

BV

3700

+ IBV

1.00E-03

VPK

3300

+ IAVE

3.00E-01

TYPE

SiC_PiN

.ENDS

* End of GAP3SHT33- CAL SPICE Model