NCN49597

http://onsemi.com

10

Table 5. ELECTRICAL CHARACTERISTICS

Parameter

Unit

Max

Typ

Min

Symbol

Test Conditions

DIGITAL INPUTS WITH PULL−DOWN: TDI, TMS, TCK, TRSTB, TEST, SEN, IO8, IO9

Low input level (Note 26)

V

High input level (Note 26)

V

Pull−down resistor (Note 26)

35

100

170

k

W

DIGITAL SCHMITT TRIGGER INPUTS: RXD, RESB, IO0..IO7, SDI

Rising threshold level (Note 27)

V

Falling threshold level (Note 27)

V

Input leakage current (Note 27)

−2

2

mA

BOOT LOADER TIMING (Parameters are valid for a baud rate of 115’200) (Note 28)

IO2 setup time to falling edge of RESB

(Note 29)

5

ms

Boot loader startup time

(Notes 29 and 30)

135

200

ms

Inter−byte timeout sent to modem

(Note 29)

20

ms

Boot loader acknowledgement after last

byte correctly received

(Note 29)

3.6

12

ms

IO2 hold time after start of acknowl-

edgement byte transmission

(Note 29)

36

ms

26. For IO8 and IO9, this parameter only applies if the pin is configured as input pin by the firmware.

27. For IO0

…IO7, this parameter only applies if the pin is configured as input pin by the firmware.

28. The timing constraints governing the boot loader when uploading firmware over the serial interface are illustrated in Figure 3.

29. These parameters will not be measured in production as the performance is determined by a digital circuit.

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

Figure 3. Timing Constraints for Uploading the Firmware over the Serial Communication Interface (SCI)

IO2

TXD

RXD

STX

ACK

RESB