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FODM3053 Datasheet(PDF) 7 Page - Fairchild Semiconductor |
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FODM3053 Datasheet(HTML) 7 Page - Fairchild Semiconductor |
7 / 8 page 7 www.fairchildsemi.com FODM3051, FODM3052, FODM3053 Rev. 1.0.0 Footprint Drawing for PCB Layout Recommended Infrared Reflow Soldering Profile 0.024 (0.61) 0.100 (2.54) 0.060 (1.52) 0.310 (7.87) 0.190 (4.83) • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended (heating) to 30 s to 60 s 90 s Time (s) 150 s 60 s 180°C 230°C (peak temperature) 210°C |
Similar Part No. - FODM3053 |
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Similar Description - FODM3053 |
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