SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N1424, Rev. A

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

STF3060C(R)

Electrical Characteristics:

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Junction Temperature

-

-55 to +150

°C

Storage Temperature

-

-55 to +150

°C

Maximum Thermal

Resistance Junction to Case

(per leg)

DC operation

6

°C/W

Approximate Weight

wt

-

2

g

Case Style

ITO-220AB

Characteristics

Symbol

Condition

Typ.

Max.

Units

0.48

0.59

-

0.70

V

Forward Voltage Drop (per

leg)*

0.41

0.55

-

0.65

V

Reverse Current (per leg)

0.024

1.2

mA

Reverse Current (per leg) *

14

45

mA

Junction Capacitance

(per leg)

712

800

pF

Voltage Rate of Change

dv/dt

-

-

10,000

V/

μs

Clip mounting, the epoxy body

away from the heatsink edge by

more than 0.110" along the lead

direction.

-

4500

Clip mounting, the epoxy body is

inside the heatsink.

-

3500

RSM Isolation Voltage

(t = 1.0 second, R. H. < =30%,

Screw mounting, the epoxy body is

inside the heatsink.

-

1500

V