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IDT7223611L30PQF Datasheet(PDF) 7 Page - Integrated Device Technology

Part # IDT7223611L30PQF
Description  CMOS SyncFIFO 64 x 36
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

IDT7223611L30PQF Datasheet(HTML) 7 Page - Integrated Device Technology

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IDT723611 CMOS SyncFIFO
64 x 36
COMMERCIAL TEMPERATURE RANGES
7
TIMING REQUIREMENTS OVER RECOMMENDED RANGES OF SUPPLY VOLTAGE AND
OPERATING FREE-AIR TEMPERATURES
IDT723611L15 IDT723611L20 IDT723611L30
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Unit
fS
Clock Frequency, CLKA or CLKB
66.7
50
33.4
Mhz
tCLK
Clock Cycle Time, CLKA or CLKB
15
20
30
Mhz
tCLKH
Pulse Duration, CLKA or CLKB HIGH
6–8–
12
ns
tCLKL
Pulse Duration, CLKA or CLKB LOW
6–8–
12
ns
tDS
Setup Time, A0-A35 before CLKA
↑ and B0-B35
4–5–6
ns
before CLKB
tENS1
CSA, W/RA, before CLKA↑; CSB, W/RB before
6–6–7
ns
CLKB
tENS2
ENA before CLKA
↑; ENB before CLKB↑
4–5–6
ns
tENS3
MBA before CLKA
↑; ENB before CLKB↑
4–5–6
ns
tPGS
Setup Time, ODD/
EVEN and PGB before
4–5–6
ns
CLKB
(1)
tRSTS
Setup Time,
RST LOW before CLKA↑
5–6–7
ns
or CLKB
(2)
tFSS
Setup Time, FS0 and FS1 before
RST HIGH
5–6–7
ns
tDH
Hold Time, A0-A35 after CLKA
↑ and B0-B35
1–1–1
ns
after CLKB
tENH1
CSA, W/RA after CLKA↑; CSB, W/RB
1–1–1
ns
after CLKB
tENH2
ENA after CLKA
↑; ENB after CLKB↑
111
ns
tENH3
MBA after CLKA
↑; MBB after CLKB↑
111
ns
tPGH
Hold TIme, ODD/
EVEN and PGB after CLKB↑(1)
0–0–0
ns
tRSTH
Hold Time,
RST LOW after CLKA↑ or CLKB↑(2)
6–6–7
ns
tFSH
Hold Time, FS0 and FS1 after
RST HIGH
4–4–4
ns
tSKEW1(3) Skew Time, between CLKA
↑ and CLKB↑
8–8–
10
ns
for
EF, FF
tSKEW2(3) Skew Time, between CLKA
↑ and CLKB↑
9–
16
20
ns
for
AE, AF
Notes:
1.
Only applies for a rising edge of CLKB that does a FIFO read.
2.
Requirement to count the clock edge as one of at least four needed to reset a FIFO.
3.
Skew time is not a timing constraint for proper device operation and is only included to illustrate the timing relation-
ship between CLKA cycle and CLKB cycle.


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