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IDT72274L20PF Datasheet(PDF) 3 Page - Integrated Device Technology

Part # IDT72274L20PF
Description  VARIABLE WIDTH SUPERSYNCO FIFO 8,192 x 18 or 16,384 x 9 16,384 x 18 or 32,768 x 9
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

IDT72274L20PF Datasheet(HTML) 3 Page - Integrated Device Technology

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IDT72264/72274 VARIABLE WIDTH SUPERSYNC FIFO
(8192 x 18 or 16384 x 9) and (16384 x 18 or 32768 x 9)
COMMERCIAL TEMPERATURE RANGES
In the serial method,
SEN together with LD are used to load
the offset registers via the Serial Input (SI). In the parallel
method,
WEN together with LD can be used to load the offset
registers via Dn.
REN together with LD can be used to read the
offsets in parallel from Qn regardless of whether serial or
parallel offset loading is selected.
During Master Reset (
MRS), the read and write pointers are
set to the first location of the FIFO. The FWFT line selects IDT
Standard Mode or FWFT Mode. The
LD pin selects one of two
partial flag default settings (127 or 1023) and, also, serial or
parallel programming. The flags are updated accordingly.
The Partial Reset (
PRS) also sets the read and write
pointers to the first location of the memory. However, the
mode setting, programming method, and partial flag offsets
are not altered. The flags are updated accordingly.
PRS is
useful for resetting a device in mid-operation, when repro-
gramming offset registers may not be convenient.
The Retransmit function allows the read pointer to be reset
to the first location in the RAM array. It is synchronized to
RCLK when
RT is LOW. This feature is convenient for
sending the same data more than once.
If, at any time, the FIFO is not actively performing a function,
the chip will automatically power down. This occurs if neither
a read nor a write occurs within 10 cycles of the faster clock,
RCLK or WCLK. During the Power Down state, supply current
consumption (ICC2) is at a minimum. Initiating any operation
(by activating control inputs) will immediately take the device
out of the Power Down state.
The IDT72264/72274 are depth expandable. The addition
of external components is unnecessary. The
IR and OR
functions, together with
REN and WEN, are used to extend the
total FIFO memory capacity.
The FS line ensures optimal data flow through the FIFO. It
is tied to GND if the RCLK frequency is higher than the WCLK
frequency or to Vcc if the RCLK frequency is lower than the
WCLK frequency
The IDT72264/72274 is fabricated using IDT’s high speed
submicron CMOS technology.
NOTES
:
1. When the data path is selected to be 9 bits wide (MAC is HIGH), D9 - D17 may be tied to ground or left open, Q9 - Q17 must be left open.
2. DNC = Do not connect
D8
Pin 1 Designator
AB
C
D
EF
G
H
J
K
L
Q0
D2
PAF
DNC
VCC
RCLK
REN
OE
GND
DNC
MRS
LD WCLK
PRS
VCC
WEN
D17
MAC
D15
D16
D11
D14
D12
D10
D9
D7
D6
PAE
D4
D3
D1
D0
Q1
Q2
GND
Q3
Q4
GND
Q8
Q7
Q10
DNC
GND
VCC
Q17 Q16
Q15
Q14
Q13 Q12
Q9
HF
EF/
OR
FF/
IR
11
10
09
08
07
06
05
04
03
02
01
RT
FWFT/
SI
D13
D5
GND
VCC
GND
Q11
Q6
Q5
3218 drw 03
SEN FS
GND
PGA (G68-1, order code: G)
TOP VIEW
PIN CONFIGURATIONS (CONT.)


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