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IDT7132SA35L48 Datasheet(PDF) 6 Page - Integrated Device Technology

Part # IDT7132SA35L48
Description  HIGH-SPEED 2K x 8 DUAL-PORT STATIC RAM
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

IDT7132SA35L48 Datasheet(HTML) 6 Page - Integrated Device Technology

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IDT7132SA/LA AND IDT7142SA/LA
HIGH-SPEED 2K x 8 DUAL-PORT STATIC RAM
MILITARY AND COMMERCIAL TEMPERATURE RANGES
6.02
6
AC ELECTRICAL CHARACTERISTICS OVER THE
OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE(5)
7132X20(2)
7132X25(6)
7132X35
7132X55
7132X100
7142X25(6)
7142X35
7142X55
7142X100
Symbol
Parameter
Min.
Max.
Min. Max.
Min.
Max. Min.
Max.
Min.
Max.
Unit
Write Cycle
tWC
Write Cycle Time(3)
20
25
35
55
100
ns
tEW
Chip Enable to End of Write
15
20
30
40
90
ns
tAW
Address Valid to End of Write
15
20
30
40
90
ns
tAS
Address Set-up Time
0
0
0
0
0
ns
tWP
Write Pulse Width(4)
15
15
25
30
55
ns
tWR
Write Recovery Time
0
0
0
0
0
ns
tDW
Data Valid to End of Write
10
12
15
20
40
ns
tHZ
Output High Z Time(1)
10
10
15
25
40
ns
tDH
Data Hold Time
0
0
0
0
0
ns
tWZ
Write Enabled to Output in High Z(1)
10
10
15
30
40
ns
tOW
Output Active From End of Write(1)
0—
0—
0—
0—
0
ns
TIMING WAVEFORM OF READ CYCLE NO. 2, EITHER SIDE (3)
CAPACITANCE(1) (TA = +25
°C,f = 1.0MHz)
Symbol
Parameter
Conditions(2) Max. Unit
CIN
Input Capacitance
VIN = 3dV
11
pF
COUT
Output Capacitance
VIN = 3dV
11
pF
NOTES:
1. This parameter is determined by device characterization but is not
production tested.
2. 3dV represents the interpolated capacitance when the input and output
signals switch from 0V to 3V or from 3V to 0V.
2692 tbl 10
CE
tACE
tHZ
tLZ
tPD
VALID DATA
tPU
50%
OE
DATAOUT
CURRENT
ICC
ISS
50%
2692 drw 08
(4)
(1)
(1)
(2)
(2)
(4)
tLZ
tHZ
tAOE
NOTES:
1. Timing depends on which signal is asserted last,
OE or CE.
2. Timing depends on which signal is deaserted first,
OE or CE.
3. R/
W = VIH, and the address is valid prior to or coincidental with CE transition Low.
4. Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA, and tBDD.
NOTES:
2692 tbl 09
1. Transition is measured
±500mV from Low or High-impedance voltage with Output Test Load (Figure 2). This parameter is guaranteed by
device characterization but is not production tested.
2. 0
°C to +70°C temperature range only, PLCC package only.
3. For Master/Slave combination, tWC = tBAA + tWP, since R/
W = VIL must occur after tBAA.
4. If
OE is low during a R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off
data to be placed on the bus for the required tDW. If
OE is High during a R/W controlled write cycle, this requirement does not apply and the
write pulse can be as short as the specified tWP.
5. “X” in part numbers indicates power rating (SA or LA).
6. Not available in DIP packages.


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