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IDT74FCT16260CTPAB Datasheet(PDF) 3 Page - Integrated Device Technology |
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IDT74FCT16260CTPAB Datasheet(HTML) 3 Page - Integrated Device Technology |
3 / 8 page 5.4 3 IDT54/74FCT16260AT/CT/ET, 162260AT/CT/ET FAST CMOS 12-BIT TRI-PORT BUS EXCHANGER MILITARY AND COMMERCIAL TEMPERATURES RANGES PIN DESCRIPTION Signal I/O Description A(1:12) I/O Bidirectional Data Port A. Usually connected to the CPU's Address/Data bus. 1B(1:12) I/O Bidirectional Data Port 1B. Connected to the even path or even bank of memory. 2B(1:12) I/O Bidirectional Data Port 2B. Connected to the odd path or odd bank of memory. LEA1B I Latch Enable Input for A-1B Latch. The Latch is open when LEA1B is HIGH. Data from the A-port is latched on the HIGH to LOW transition of LEA1B. LEA2B I Latch Enable Input for A-2B Latch. The Latch is open when LEA2B is HIGH. Data from the A-Port is latched on the HIGH to LOW transition of LEA2B. LE1B I Latch Enable Input for the 1B-A Latch. The Latch is open when LE1B is HIGH. Data from the 1B port is latched on the HIGH to LOW transition of LE1B. LE2B I Latch Enable Input for the 2B-A Latch. The Latch is open when LE2B is HIGH. Data from the 2B port is latched on the HIGH to LOW transition of LE2B. SEL I 1B or 2B Path Selection. When HIGH, SEL enables data transfer from 1B Port to A Port. When LOW, SEL enables data transfer from 2B Port to A Port. OEA I Output Enable for A Port (Active LOW). OE1B I Output Enable for 1B Port (Active LOW). OE2B I Output Enable for 2B Port (Active LOW). 3032 tbl 01 ABSOLUTE MAXIMUM RATINGS (1) FUNCTION TABLES (2) 3032 tbl 04 Inputs Output 1B 2B SEL LE1B LE2B OEA OEA A H X HHX L H L X HHX L L XX H L X L A(1) XH L X H L H XL L X H L L XX L X L L A(1) X XXXXH Z Inputs Outputs A LEA1B LEA2B OE1B OE1B OE2B OE2B 1B 2B HH H L L H H LH H L L L L H H LLL H B(1) L H LLL L B(1) HL HL L B(1) H LL H L L B(1) L XL LLL B(1) B(1) X XXH H Z Z X X X L H Active Z X X X H L Z Active X X X L L Active Active 3032 tbl 05 NOTES: 1. Output level before the indicated steady-state input conditions were established. 2. H = HIGH Voltage Level L = LOW Voltage Level X = Don't Care Z = High Impedance ↑ = LOW-to-HIGH Transition Symbol Description Max. Unit VTERM(2) Terminal Voltage with Respect to GND –0.5 to +7.0 V VTERM(3) Terminal Voltage with Respect to GND –0.5 to VCC +0.5 V TSTG Storage Temperature –65 to +150 °C IOUT DC Output Current –60 to +120 mA 3032 tbl 02 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RAT- INGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. All device terminals except FCT162XXXT Output and I/O terminals. 3. Output and I/O terminals for FCT162XXXT. CAPACITANCE (TA = +25 °C, F = 1.0MHZ) 3032 tbl 03 Symbol Parameter(1) Conditions Typ. Max. Unit CIN Input Capacitance VIN = 0V 3.5 6.0 pF CI/O I/O Capacitance VOUT = 0V 3.5 8.0 pF NOTE: 1. This parameter is measured at characterization but not tested. |
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