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B32671L8222 Datasheet(PDF) 9 Page - TDK Electronics |
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B32671L8222 Datasheet(HTML) 9 Page - TDK Electronics |
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9 / 16 page  Immersion depth 2.0 +0/ 0.5 mm from capacitor body or seating plane Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection No visible damage ∆C/C 0 2% for MKT/MKP/MFP 5% for EMI suppression capacitors tan δ As specified in sectional specification B32671L8 High V AC, high temperature (wound) Page 9 of 16 Please read Cautions and warnings and Important notes at the end of this document. |
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