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GT28F016B3B150 Datasheet(PDF) 7 Page - Intel Corporation |
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GT28F016B3B150 Datasheet(HTML) 7 Page - Intel Corporation |
7 / 49 page E SMART 3 ADVANCED BOOT BLOCK–BYTE-WIDE 7 PRELIMINARY 2.1 Package Pinouts The Smart 3 Advanced Boot Block flash memory is available in 40-lead TSOP (see Figure 1) and 48- ball µBGA packages (see Figures 2 and 3). In Figure 1, pin changes from one density to the next are circled. Both packages, 40-lead TSOP and 48- ball µBGA package, are 8-bits wide and fully upgradeable across product densities (from 8 Mb to 16 Mb). Advanced Boot Block 40-Lead TSOP 10 mm x 20 mm TOP VIEW 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 20 19 17 18 1 2 3 4 5 6 7 8 9 10 11 12 13 14 16 15 21 22 23 24 28F008 28F016 A 16 A 15 A 14 A 13 A 12 A 11 A 9 A 8 WE# RP# WP# A 7 A 6 A 5 A 4 A 3 A 2 A 1 V PP A 18 A 16 A 15 A 14 A 13 A 12 A 11 A 9 A 8 WE# RP# WP# A 7 A 6 A 5 A 4 A 3 A 2 A 1 V PP A 18 28F008 28F016 A 17 GND A 10 DQ 7 DQ 6 DQ 5 DQ 4 V CCQ V CC NC DQ 3 DQ 2 DQ 1 OE# GND CE# A 0 NC A 17 GND A 10 DQ 7 DQ 6 DQ 5 DQ 4 V CCQ V CC NC DQ 3 DQ 2 DQ 1 OE# GND CE# A 0 A 19 A 19 A 20 DQ 0 DQ 0 0605-01 Figure 1. 40-Lead TSOP Package |
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