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IDT7142SA55L48I Datasheet(PDF) 2 Page - Integrated Device Technology |
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IDT7142SA55L48I Datasheet(HTML) 2 Page - Integrated Device Technology |
2 / 16 page 2 IDT7132SA/LA and IDT 7142SA/LA High Speed 2K x 8 Dual Port Static RAM Military, Industrial and Commercial Temperature Ranges Pin Configurations(1,2,3) NOTES: 1. All VCC pins must be connected to the power supply. 2. All GND pins must be connected to the ground supply. 3. P48-1 package body is approximately .55 in x 2.43 in x .18 in. C48-2 package body is approximately .62 in x 2.43 in x .15 in. L48-1 package body is approximately .57 in x .57 in x .68 in. F48-1 package body is approximately .75 in x .75 in x .11 in. 4. This package code is used to reference the package diagram. 5. This text does not indicate orientation of the actual part-marking. Description TheIDT7132/IDT7142arehigh-speed2Kx8Dual-PortStaticRAMs. TheIDT7132isdesignedtobeusedasastand-alone8-bitDual-PortRAM or as a “MASTER” Dual-Port RAM together with the IDT7142 “SLAVE” Dual-Portin16-bit-or-morewordwidthsystems.UsingtheIDTMASTER/ SLAVE Dual-Port RAM approach in 16-or-more-bit memory system applicationsresultsinfull-speed,error-freeoperationwithouttheneedfor additionaldiscretelogic. Both devices provide two independent ports with separate control, address,andl/Opinsthatpermitindependent,asynchronousaccessfor reads or writes to any location in memory. An automatic power down feature,controlledbyCEpermitstheon-chipcircuitryofeachporttoenter a very low standby power mode. FabricatedusingIDT’sCMOShigh-performancetechnology,these devices typically operate on only 325mW of power. Low-power (LA) versions offer battery backup data retention capability, with each Dual- Port typically consuming 200µW from a 2V battery. The IDT7132/7142 devices are packaged in a 48-pin sidebraze or plastic DIPs, 48-pin LCCs, 52-pin PLCCs, and 48-lead flatpacks. Military grade product is manufactured in compliance with the latest revision of MIL-PRF-38535 QML, making it ideally suited to military temperature applications demanding the highest level of performance and reliability. 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 148 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 IDT7132/ 7142 PorC P48-1(4) & C48-2(4) 48-Pin DIP Top View(5) 2692 drw 02 GND I/O6R I/O5R I/O4R I/O3R I/O2R I/O1R I/O0R I/O7L I/O6L I/O5L I/O4L CER CEL OEL A0L BUSYL R/ WL R/ WR BUSYR VCC OER A0R A1R A2R A3R A4R A5R A6R A7R A8R A9R I/O7R I/O3L A1L A2L A3L A4L A5L A6L A7L A8L A9L I/O0L I/O1L I/O2L A10L A10R , IDT7132/42L48 or F L48-1(4) & F48-1(4) 48-Pin LCC/ Flatpack Top View(5) INDEX 65 43 2 1 48 47 46 45 44 43 19 20 21 22 23 25 26 27 28 29 30 24 42 41 40 39 38 37 36 35 34 33 32 31 7 8 9 10 11 12 13 14 15 16 17 18 2692 drw 03 A0R A1R A2R A3R A4R A5R A6R A7R A8R A9R I/O7R A1L A2L A3L A4L A5L A6L A7L A8L A9L I/O0L I/O1L I/O2L I/O6R , Capacitance(1) (TA = +25°C,f = 1.0MHz) NOTES: 1. This parameter is determined by device characterization but is not production tested. 2. 3dV represents the interpolated capacitance when the input and output signals switch from 3V to 0V. Symbol Parameter Conditions(2) Max. Unit CIN Input Capacitance VIN = 3dV 11 pF COUT Output Capacitance VOUT = 3dV 11 pF 2692 tbl 00 |
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