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TE28F800C3B90 Datasheet(PDF) 1 Page - Intel Corporation |
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TE28F800C3B90 Datasheet(HTML) 1 Page - Intel Corporation |
1 / 59 page E PRODUCT PREVIEW May 1998 Order Number: 290645-001 n Flexible SmartVoltage Technology 2.7 V–3.6 V Read/Program/Erase 2.7 V or 1.65 V I/O Option Reduces Overall System Power 12 V for Fast Production Programming n High Performance 2.7 V–3.6 V: 90 ns Max Access Time 3.0 V–3.6 V: 80 ns Max Access Time n Optimized Architecture for Code Plus Data Storage Eight 8-Kbyte Blocks, Top or Bottom Locations Up to Sixty-Three 64-KB Blocks Fast Program Suspend Capability Fast Erase Suspend Capability n Flexible Block Locking Lock/Unlock Any Block Full Protection on Power-Up WP# Pin for Hardware Block Protection VPP = GND Option VCC Lockout Voltage n Low Power Consumption 9 mA Typical Read Power 10 µA Typical Standby Power with Automatic Power Savings Feature n Extended Temperature Operation –40 °C to +85 °C n Easy-12 V Faster Production Programming No Additional System Logic n 128-bit Protection Register 64-bit Unique Device Identifier 64-bit User Programmable OTP Cells n Extended Cycling Capability Minimum 100,000 Block Erase Cycles n Flash Data Integrator Software Flash Memory Manager System Interrupt Manager Supports Parameter Storage, Streaming Data (e.g., voice) n Automated Word/Byte Program and Block Erase Command User Interface Status Registers n SRAM-Compatible Write Interface n Cross-Compatible Command Support Intel Basic Command Set Common Flash Interface n x 16 for High Performance 48-Ball µBGA* Package 48-Lead TSOP Package n x 8 I/O for Space Savings 48-Ball µBGA* Package 40-Lead TSOP Package n 0.25 µ ETOX™ VI Flash Technology The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP, and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp. 3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY 28F008C3, 28F016C3, 28F032C3 28F800C3, 28F160C3, 28F320C3 |
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