ACS10DMSR datasheet(6/8 Pages) INTERSIL

Part #	ACS10DMSR

Description	Radiation Hardened Triple Three-Input NAND Gate

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Manufacturer	INTERSIL [Intersil Corporation]

Direct Link	http://www.intersil.com/cda/home

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6

ACS10MS

Metallization Mask Layout

ACS10MS

B1

(02)

A1

(01)

VCC

(14)

C1

(13)

A3

(09)

Y3

(08)

GND

(07)

Y2

(06)

A2 (03)

B2 (04)

NC

C2 (05)

(10) B3

NC

(11) C3

(12) Y1

Die Characteristics

DIE DIMENSIONS:

88 mils x 88 mils

2,240mm x 2,240mm

METALLIZATION:

Type: AlSiCu

Metal 1 Thickness: 6.75k

Å (Min), 8.25kÅ (Max)

Metal 2 Thickness: 9k

Å (Min), 11kÅ (Max)

GLASSIVATION:

Type: SiO2

Thickness: 8k

Å

±1kÅ

DIE ATTACH:

Material: Silver Glass or JM 7000 after 7/1/95

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

> 4.3 mils x 4.3 mils

> 110

µm x 110µm

Spec Number

518814

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Manufacturer	Part #	Datasheet	Description
Intersil Corporation	ACTS10MS	112Kb / 8P	Radiation Hardened Triple Three-Input NAND Gate April 1995
Intersil Corporation	HCS10MS	181Kb / 8P	Radiation Hardened Triple 3-Input NAND Gate September 1995
Renesas Technology Corp	HCS10MS	389Kb / 8P	Radiation Hardened Triple 3-Input NAND Gate September 1995
Intersil Corporation	HCTS10MS	147Kb / 9P	Radiation Hardened Triple 3-Input NAND Gate September 1995
Intersil Corporation	ACS30MS	38Kb / 2P	Radiation Hardened 8-Input NAND Gate July 1999
Renesas Technology Corp	HCTS30MS	391Kb / 9P	Radiation Hardened 8-Input NAND Gate August 1995
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Intersil Corporation	HCTS30MS	134Kb / 10P	Radiation Hardened 8-Input NAND Gate August 1995
Intersil Corporation	ACTS00MS	85Kb / 8P	Radiation Hardened Quad 2-Input NAND Gate April 1995
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ACS10DMSR Datasheet(PDF) 6 Page - Intersil Corporation

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