The THAT 300, 320 and 340 are available in 14-pin

PDIP and 14-pin surface mount (SOIC) packages.

Package dimensions are shown below.

The 300-series packages are entirely lead-free. The

lead-frames are copper, plated with successive layers of

nickel, palladium, and gold. This approach makes it

possible to solder these devices using lead-free and lead-

bearing solders.

Neither the lead-frames nor the plastic mold

compounds used in the 300-series contains any hazard-

ous substances as specified in the European Union's

Directive on the Restriction of the Use of Certain Hazard-

ous Substances in Electrical and Electronic Equipment

2002/95/EG of January 27, 2003. The surface-mount

package is suitable for use in a 100% tin solder process.

Document 600041 Rev 02

Page 4 of 5

THAT 300 Series Transistor Array ICs

THAT Corporation; 45 Sumner Street; Milford, Massachusetts 01757-1656; USA

Tel: +1 508 478 9200; Fax: +1 508 478 0990; Web: www.thatcorp.com

Copyright © 2010, THAT Corporation. All rights reserved.

0.750±0.004

(19.05±0.10)

0.25±.004

(6.35±0.10)

0.30 ±0.02

(7.62 ±0.5)

0.060

(1.52)

0.075

(1.91)

0.10 Typ.

(2.54)

0.018

(0.46)

0.125±0.004

(3.18±0.10)

Typ.

1

0.010

(0.25)

Figure 4. Dual-In-Line Package Outline

0.050

(1.27)

Typ

0.245

(6.2)

Max

0.157

(3.99)

Max

0.018 (0.46)

Max

0.344 (8.74)

Max

0.069

(1.75)

Max

0.010

(0.25)

Max

1

Figure 5. Surface-Mount Package Outline

Packaging and Soldering Information

Parameter

Symbol

Conditions

Typ

Units

Through-hole package

See Fig. 4 for dimensions

14 Pin PDIP

Thermal Resistance

DIP package soldered to board

100

ºC/W

Environmental Regulation Compliance

Complies with January 27, 2003 RoHS requirements

Surface mount package

See Fig. 5 for dimensions

14 Pin SOP

Thermal Resistance

SO package soldered to board

100

ºC/W

Soldering Reflow Profile

JEDEC JESD22-A113-D (250 ºC)

Moisture Sensitivity Level

MSL Above-referenced JEDEC soldering profile

1

Environmental Regulation Compliance

Complies with RoHS requirements

Package Characteristics