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AD7849BR Datasheet(PDF) 6 Page - Analog Devices |
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AD7849BR Datasheet(HTML) 6 Page - Analog Devices |
6 / 20 page AD7849 Rev. C | Page 6 of 20 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 5. Parameter Rating VDD to DGND −0.4 V to +17 V VCC to DGND1 −0.4 V, VDD + 0.4 V or +7 V (whichever is lower) VSS to DGND −0.4 V to −17 V VREF+ to DGND VDD + 0.4 V, VSS − 0.4 V VREF− to DGND VDD + 0.4 V, VSS − 0.4 V VOUT to DGND2 VDD + 0.4 V, VSS − 0.4 V or ±10 V (whichever is lower) ROFS to DGND VDD + 0.4 V, VSS − 0.4 V Digital Input Voltage to DGND −0.4 V to VCC + 0.4 V Input Current to any Pin Except Supplies3 ±10 mA Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C 20-Lead PDIP Power Dissipation 875 mW θJA Thermal Impedance 102°C/W Lead Temperature (Soldering, 10 sec) 260°C 20-Lead SOIC Power Dissipation 875 mW θJA Thermal Impedance 74°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 VCC must not exceed VDD by more than 0.4 V. If it is possible for this to happen during power-up or power-down (for example, if VCC is greater than 0.4 V while VDD is still 0 V), the following diode protection scheme ensures protection. SD103C 1N5711 1N5712 1N4148 VDD VCC VDD VCC AD7849 2 VOUT can be shorted to DGND, + 10 V, − 10 V, provided that the power dissipation of the package is not exceeded. 3 Transient currents of up to 100 mA do not cause SCR latch-up. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
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