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CD4095BMS Datasheet(PDF) 10 Page - Intersil Corporation |
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CD4095BMS Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 10 page 1103 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com CD4095BMS, CD4096BMS METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches FIGURE 13. TYPICAL CLOCK FREQUENCY vs SUPPLY VOLTAGE (TOGGLE MODE - SEE FIGURE 4) FIGURE 14. TYPICAL POWER DISSIPATION vs INPUT CLOCK FREQUENCY Chip Dimensions and Pad Layouts Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). Typical Performance Characteristics (Continued) 0 5 SUPPLY VOLTAGE (VDD) (V) 510 15 20 10 15 20 25 30 AMBIENT TEMPERATURE (TA) = +25 oC trl tf = 5ns CL = 50pF 10V 5V 10V 6 4 2 INPUT FREQUENCY (fIN) (kHz) 110 102 103 104 4 2 103 102 10 1 AMBIENT TEMPERATURE (TA) = +25 oC SUPPLY VOLTAGE (VDD) = 15V 6 4 26 4 26 4 26 4 2 LOAD CAPACITANCE (CL) = 50pF CL = 15pF 4 2 4 2 4 2 4 2 106 104 4 2 4 2 105 MAXIMUM PACKAGE DISSIPATION =200mW CD4095BHMS CD4096BHMS |
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