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HT9B92G Datasheet(PDF) 3 Page - Holtek Semiconductor Inc |
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HT9B92G Datasheet(HTML) 3 Page - Holtek Semiconductor Inc |
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3 / 21 page  Rev. 1.00 3 April 18, 2014 HT9B92G Pad Assignment 25 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 1 2 3 4 5 6 7 8 9 32 31 30 29 28 27 26 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 X Y ALIGN_A ALIGN_B 66 Pad Dimensions Item Number. Size Unit X Y Chip size — 2402 1100 μm Chip thickness — 508 μm Pad pitch 1~9, 30~66 60 μm 24~29 80 μm 11~22 85 μm Bump size Output pad 2~9 67 47 μm 31~66 47 67 μm Input pad 13~20 74 74 μm Dummy pad 11, 12, 21, 22 74 74 μm 1, 24~30 47 67 μm Bump height All pad 18±3 μm Alignment mark Dimensions Item Number Size Unit ALIGN_A 10 20mm (X, Y) 40mm 10mm 10mm 20mm 40mm μm ALIGN_B 23 20mm (X, Y) 40mm 20mm 20mm 20mm 10mm 10mm μm |
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