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CTS191MS Datasheet(PDF) 10 Page - Intersil Corporation |
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CTS191MS Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 10 page 589 HCTS191MS Die Characteristics DIE DIMENSIONS: 104 x 86 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCTS191MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS191 is TA14447A. Q1 P1 VCC Q0 (3) CE (4) U/D (5) Q2 (6) (9) (10) (11) PL (12) TC (13) RC (2) (1) (16) P3 P2 (8) GND (14) CP Q3 (7) (15) P0 Spec Number 518621 |
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