3-222

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate

and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

Sales Office Headquarters

NORTH AMERICA

Intersil Corporation

P. O. Box 883, Mail Stop 53-204

Melbourne, FL 32902

TEL: (407) 724-7000

FAX: (407) 724-7240

EUROPE

Intersil SA

Mercure Center

100, Rue de la Fusee

1130 Brussels, Belgium

TEL: (32) 2.724.2111

FAX: (32) 2.724.22.05

ASIA

Intersil (Taiwan) Ltd.

Taiwan Limited

7F-6, No. 101 Fu Hsing North Road

Taipei, Taiwan

Republic of China

TEL: (886) 2 2716 9310

FAX: (886) 2 2715 3029

FSF9250D, FSF9250R

TO-254AA

3 LEAD JEDEC TO-254AA HERMETIC METAL PACKAGE

D

L

Q

e

A

E

ØP

Ø

b

0.065 R MAX.

TYP.

12

3

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.249

0.260

6.33

6.60

-

0.040

0.050

1.02

1.27

-

Øb

0.035

0.045

0.89

1.14

2, 3

D

0.790

0.800

20.07

20.32

-

E

0.535

0.545

13.59

13.84

-

e

0.150 TYP

3.81 TYP

4

0.300 BSC

7.62 BSC

4

0.245

0.265

6.23

6.73

-

0.140

0.160

3.56

4.06

4

L

0.520

0.560

13.21

14.22

-

ØP

0.139

0.149

3.54

3.78

-

Q

0.110

0.130

2.80

3.30

-

NOTES:

1. These dimensions are within allowable dimensions of Rev. A of

JEDEC outline TO-254AA dated 11-86.

2. Add typically 0.002 inches (0.05mm) for solder coating.

3. Lead dimension (without solder).

4. Position of lead to be measured 0.250 inches (6.35mm) from bot-

tom of dimension D.

5. Die to base BeO isolated, terminals to case ceramic isolated.

6. Controlling dimension: Inch.

7. Revision 1 dated 1-93.

WARNING!

BERYLLIA WARNING PER MIL-S-19500

Packages containing beryllium oxide (BeO) shall not be ground, machined, sandblasted, or subject to any mechanical

operation which will produce dust containing any beryllium compound. Packages containing any beryllium compound

shall not be subjected to any chemical process (etching, etc.) which will produce fumes containing beryllium or its’

compounds.