9

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FSJ055D, FSJ055R

TO-254AA

3 LEAD JEDEC TO-254AA HERMETIC METAL PACKAGE

WARNING!

BERYLLIA WARNING PER MIL-S-19500

Packages containing beryllium oxide (BeO) shall not be ground, machined, sandblasted, or subject to any mechanical operation

which will produce dust containing any beryllium compound. Packages containing any beryllium compound shall not be

subjected to any chemical process (etching, etc.) which will produce fumes containing beryllium or its’ compounds.

D

L

Q

e

A

E

ØP

Ø

b

0.065 R MAX.

TYP.

12

3

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.249

0.260

6.33

6.60

-

0.040

0.050

1.02

1.27

-

Øb

0.035

0.045

0.89

1.14

2, 3

D

0.790

0.800

20.07

20.32

-

E

0.535

0.545

13.59

13.84

-

e

0.150 TYP

3.81 TYP

4

0.300 BSC

7.62 BSC

4

0.245

0.265

6.23

6.73

-

0.140

0.160

3.56

4.06

4

L

0.520

0.560

13.21

14.22

-

ØP

0.139

0.149

3.54

3.78

-

Q

0.110

0.130

2.80

3.30

-

NOTES:

1. These dimensions are within allowable dimensions of Rev. A of

JEDEC outline TO-254AA dated 11-86.

2. Add typically 0.002 inches (0.05mm) for solder coating.

3. Lead dimension (without solder).

4. Position of lead to be measured 0.250 inches (6.35mm) from bottom

of dimension D.

5. Die to base BeO isolated, terminals to case ceramic isolated.

6. Controlling dimension: Inch.

7. Revision 1 dated 1-93.