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FSPL230D1 Datasheet(PDF) 8 Page - Intersil Corporation |
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FSPL230D1 Datasheet(HTML) 8 Page - Intersil Corporation |
8 / 8 page 4-8 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with- out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil Ltd. 8F-2, 96, Sec. 1, Chien-kuo North, Taipei, Taiwan 104 Republic of China TEL: 886-2-2515-8508 FAX: 886-2-2515-8369 FSPL230R, FSPL230F TO-205AF 3 LEAD JEDEC TO-205AF HERMETIC METAL CAN PACKAGE L A Øb ØD1 ØD h 1 2 3 e e1 SEATING PLANE 90o e2 j k P 45o SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A 0.160 0.180 4.07 4.57 - Øb 0.016 0.021 0.41 0.53 2, 3 ØD 0.350 0.370 8.89 9.39 - ØD1 0.315 0.335 8.01 8.50 - e 0.095 0.105 2.42 2.66 4 e1 0.190 0.210 4.83 5.33 4 e2 0.095 0.105 2.42 2.66 4 h 0.010 0.020 0.26 0.50 - j 0.028 0.034 0.72 0.86 - k 0.029 0.045 0.74 1.14 - L 0.500 0.560 12.70 14.22 3 P 0.075 - 1.91 - 5 NOTES: 1. These dimensions are within allowable dimensions of Rev. E of JEDEC TO-205AF outline dated 11-82. 2. Lead dimension (without solder). 3. Solder coating may vary along lead length, add typically 0.002 inches (0.05mm) for solder coating. 4. Position of lead to be measured 0.100 inches (2.54mm) from bottom of seating plane. 5. This zone controlled for automatic handling. The variation in actual diameter within this zone shall not exceed 0.010 inches (0.254mm). 6. Lead no. 3 butt welded to stem base. 7. Controlling dimension: Inch. 8. Revision 3 dated 6-94. |
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