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HA9P5221-5 Datasheet(PDF) 10 Page - Intersil Corporation |
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HA9P5221-5 Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 12 page 10 Die Characteristics DIE DIMENSIONS: 72 mils x 94 mils 1840 µm x 2400µm METALLIZATION: Type: Al, 1% Cu Thickness: 16k Å ±2kÅ PASSIVATION: Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.) Silox Thickness: 12k Å ±2kÅ Nitride Thickness: 3.5k Å ±1.5kÅ SUBSTRATE POTENTIAL (POWERED UP): V- TRANSISTOR COUNT: 62 PROCESS: Bipolar Dielectric Isolation Metallization Mask Layout HA-5221 -BAL +BAL V+ OUT V- +IN -IN HA-5221 |
Similar Part No. - HA9P5221-5 |
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Similar Description - HA9P5221-5 |
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