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HA7-5222883 Datasheet(PDF) 5 Page - Intersil Corporation |
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HA7-5222883 Datasheet(HTML) 5 Page - Intersil Corporation |
5 / 8 page 3-173 HA-5222/883 Die Characteristics DIE DIMENSIONS: 78 x 185 x 19 mils ± 1 mils 1980 x 4690 x 483 µm ± 25.4µm METALLIZATION: Type: Al, 1% Cu Thickness: 16k Å ± 2kÅ GLASSIVATION: Type: Nitride (Si3N4) over Silox (SIO2 5% Phos.) Silox Thickness: 12k Å ± 2kÅ Nitride Thickness: 3.5k Å ± 1.5kÅ WORST CASE CURRENT DENSITY: 4.2 x 104A/cm2 SUBSTRATE POTENTIAL (Powered Up): V- TRANSISTOR COUNT: 128 PROCESS: Bipolar Dielectric Isolation Metallization Mask Layout HA-5222/883 OUT1 V+ OUT2 -IN2 +IN2 +IN1 -IN1 V- Spec Number 511062-883 |
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