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HCS109KMSR Datasheet(PDF) 9 Page - Intersil Corporation |
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HCS109KMSR Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 9 page 111 HCS109MS Die Characteristics DIE DIMENSIONS: 89 x 88 mils 2.25 x 2.24mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCS109MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS109 is TA14340A. R1 (1) J1 (2) K1 (3) CP1 (4) S1 (5) Q1 (6) Q1 (7) GND (8) Q2 (9) Q2 (10) (11) S2 (12) CP2 (13) K2 (14) J2 (15) R2 VCC (16) Spec Number 518748 |
Similar Part No. - HCS109KMSR |
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Similar Description - HCS109KMSR |
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