FF60UP30DN datasheet(1/3 Pages) THINKISEMI

Part #	FF60UP30DN

Description	60.0 Ampere,300 Volt Common Cathode Fast Recovery Epitaxial Diode

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Manufacturer	THINKISEMI [Thinki Semiconductor Co., Ltd.]

Direct Link	http://www.thinkisemi.com

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ABSOLUTE MAXIMUM RATINGS

TC=25°C unless otherwise specified

ELECTRICAL CHARACTERISTICS

TC=25°C unless otherwise specified

Symbol

Parameter

Test Conditions

Values

Unit

VR

Maximum D.C. Reverse Voltage

300

V

VRRM

Maximum Repetitive Reverse Voltage

300

V

IF(AV)

Average Forward Current

TC=110°C, Per Diode

30

A

TC=110°C, Per Package

60

A

IF(RMS)

RMS Forward Current

TC=110°C, Per Diode

42

A

IFSM

Non-Repetitive Surge Forward Current

TJ=45°C, t=10ms, 50Hz, Sine

480

A

PD

Power Dissipation

156

W

TJ

Junction Temperature

-55to +150

°C

TSTG

Storage Temperature Range

-55 to +150

°C

Torque

Module-to-Sink

Recommended（M3）

1.1

N·m

Rth(J-C)

Thermal Resistance

Junction-to-Case, Per Diode

0.8

°C /W

Weight

6

g

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

IRM

Reverse Leakage Current

VR=300V

--

10

µA

VR=300V, TJ=125°C

--

10

mA

VF

Forward Voltage

IF=30A

--

1.25

1.8

V

IF=30A, TJ=125°C

--

1.12

--

V

trr

Reverse Recovery Time

IF=1A, VR=30V, diF/dt=-200A/μs

--

22

--

ns

trr

Reverse Recovery Time

VR=150V, IF=30A

diF/dt=-200A/μs, TJ=25°C

--

35

--

ns

IRRM

Max. Reverse Recovery Current

--

2.5

--

A

trr

Reverse Recovery Time

VR=150V, IF=30A

diF/dt=-200A/μs, TJ=125°C

--

70

--

ns

IRRM

Max. Reverse Recovery Current

--

6.8

--

A

®

FF60UP30DN

Pb Free Plating Product

FF60UP30DN

60.0 Ampere,300 Volt Common Cathode Fast Recovery Epitaxial Diode

Pb

·

Ultrafast Recovery Time

·

Soft Recovery Characteristics

·

Low Recovery Loss

·

Low Forward Voltage

·

High Surge Current Capability

·

Low Leakage Current

APPLICATION

GENERAL DESCRIPTION

· Freewheeling, Snubber, Clamp

· Inversion Welder

· PFC

· Plating Power Supply

· Ultrasonic Cleaner and Welder

· Converter & Chopper

· UPS

PRODUCT FEATURE

FF60UP30DN using the lastest FRED FAB process(planar passivation chip) with ultrafast and soft recovery characteristic.

http://www.thinkisemi.com/

Page 1/3

Rev.05

TO-3PB/TO-3PN

Internal Configuration

Cathode(Bottom Side Metal Heatsink)

Cathode

Anode

Base Backside

—

Anode

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