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HCTS138KMSR Datasheet(PDF) 9 Page - Intersil Corporation |
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HCTS138KMSR Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 9 page 518 HCTS138MS Die Characteristics DIE DIMENSIONS: 85 x 101 mils METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCTS138MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS138 is TA14461A. A1 A0 VCC A2 (3) E1 (4) E2 (5) E3 (6) (8) (9) (10) (11) Y4 (12) Y3 (13) Y2 (14) Y1 (2) (1) (16) GND Y6 Y5 (7) Y0 (15) NC NC Y7 NC NC Spec Number 518605 |
Similar Part No. - HCTS138KMSR |
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Similar Description - HCTS138KMSR |
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