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HCTS161AK Datasheet(PDF) 9 Page - Intersil Corporation |
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HCTS161AK Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 9 page 9 HCTS161AMS Die Characteristics DIE DIMENSIONS: 86 x 104mils 2.19 x 2.65mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCTS161AMS NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS161A is TA14446A. CP MR VCC P0 (3) P1 (4) P2 (5) P3 (6) (9) (10) (11) Q3 (12) Q2 (13) Q1 (2) (1) (16) SPE TE (8) GND (14) Q0 PE (7) (15) TC Spec Number 518888 |
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