HCTS365DMSR datasheet(10/10 Pages) INTERSIL

Part #	HCTS365DMSR

Description	Radiation Hardened Hex Buffer/Line Driver Non-Inverting

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Manufacturer	INTERSIL [Intersil Corporation]

Direct Link	http://www.intersil.com/cda/home

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HCTS365MS

Die Characteristics

DIE DIMENSIONS:

108 x 106 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å

± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å

± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS365MS

NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS365 is TA14413A.

OE1

(1)

A1

(2)

A2 (4)

Y2 (5)

A3 (6)

Y3

(7)

GND

(8)

Y4

(9)

(12) A5

(13) Y6

(14) A6

NC

OE2

(15)

VCC

(16)

(11) Y5

Y1

(3)

NC

A4

(10)

Spec Number

518637

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HCTS365DMSR Datasheet(PDF) 10 Page - Intersil Corporation

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